Miniaturization in semiconductor and electronics manufacturing has advanced significantly, yet the fabrication of nanostructures continues to present dynamic challenges. Manufacturers supporting the semiconductor and consumer electronics industries have made remarkable progress toward sustainable scaling, enabling the production of smaller, more powerful, and energy-efficient devices. However, achieving the required precision to manufacture such tiny structures necessitates continuous innovation in positioning technology, which plays a crucial role in meeting the strict requirements of modern production processes.
In semiconductor manufacturing, positioning systems must be customized for specific production tasks due to the varying and often stringent demands of different processes. These systems are evaluated based on factors like accuracy, repeatability, travel distances, and step size. The smallest step, or Minimum Incremental Motion (MIM), must be finely controlled, ensuring precise operations. However, MIM and resolution are distinct parameters that are often confused. Step size affects the system’s ability to achieve reliable motion, and manufacturers offer calibration services to ensure accuracy and repeatability. These systems are also evaluated for their ability to settle quickly at a defined position after moving, a crucial factor for precision in processing.
There are two primary types of positioning systems in the semiconductor industry: mechanical and air-bearing systems. Mechanical systems use traditional bearings such as ball or crossed-roller types. However, air-bearing positioning systems are increasingly favored for their frictionless precision. These systems rely on a thin layer of compressed air or gas to create motion, eliminating the friction and play seen in mechanical systems. This leads to reduced sources of error and better performance in high-precision applications, such as wafer inspection and lithography. The absence of mechanical contact also reduces heat generation and improves positional stability, allowing for smoother, more consistent motion with step sizes down to nanometers.
Another innovation in positioning technology is the use of silicon carbide (SiC) in sliding carriages. SiC’s high rigidity and low weight offer improved performance and flexibility compared to traditional materials, enabling faster dynamic movements and higher throughput. Furthermore, advanced solutions such as interferometer-based measurement systems, integrated directly into the positioning system, can further enhance absolute accuracy and reduce errors caused by mechanical misalignments.
The importance of miniaturization is driven by several key factors. Moore’s Law, which predicts that the number of transistors on a chip will double approximately every two years, demands continuous advancement in manufacturing processes. Innovations like extreme-ultraviolet lithography, high-k/metal gate stacks, and fin field-effect transistors (FinFETs) are helping to overcome the physical limitations of traditional silicon-based transistors, allowing for smaller and more efficient designs. Moreover, as smaller transistors generate less heat and consume less power, manufacturers can create more powerful and energy-efficient devices that meet the demands of modern consumer electronics.
External pressures also push the need for smaller components. The increasing demand for faster, more energy-efficient mobile devices, along with the cost reductions required to stay competitive, has accelerated the drive toward miniaturization. Additionally, as the number of transistors on a chip increases, the cost per transistor decreases, leading to reduced costs and higher yields.
In conclusion, the semiconductor industry faces significant challenges in miniaturization, but advancements in positioning technology, lithography, materials, and power efficiency continue to push the boundaries. The creation of smaller, more complex systems on chips is only achievable if manufacturing technology evolves at a similar pace, ensuring high precision, reliability, and system availability.